Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...

Qualcomm just launched its new Oryon CPUs and the Snapdragon 8 Elite at the Snapdragon Summit in Maui. While these chips might be designed for phones and not PCs, the next-gen Oryon CPU core within ...

The Snapdragon 8 Elite Gen 5 shows severe thermal stress in tests due to the chip's generated heat, forcing flagships to cut performance.

IC distributors have expressed optimism regarding the semiconductor market outlook for 2025, generally believing that overall circumstances will exceed those of 2024. They anticipate that a variety of ...

David Lumb is a senior reporter covering mobile and gaming spaces. Over the last decade, he's reviewed phones for TechRadar as well as covered tech, gaming, and culture for Engadget, Popular Mechanics ...

Apple has bought IC Mask Design, a firm specializing in the layout of chips and processors. Apple is continuously acquiring companies, and most recently appears to have been buying ones concerned with ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Expertise from Forbes Councils members, operated under license. Opinions expressed are those of the author. In other words, we’re building the factories, but we may not have the talent to design, ...

TAIPEI (Taiwan News) — The Ministry of Economic Affairs will provide NT$840 million (US$25.8 million) in subsidies to six ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.