$AMD $TSM 馃殌馃殌馃殌TSMC is accelerating the expansion of its 2nm advanced process capacity. Senior Vice President and Deputy Co-COO Hou Yung-ching released a key signal, pointing out that in order to meet the explosive demand for artificial intelligence (AI) and high-performance computing (HPC), TSMC is pushing forward its expansion plan at "twice the speed" compared to the past. This year, five 2-nanometer wafer fabs have entered the ramp-up phase, setting a record for the most aggressive expansio
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$AMD $TSM 馃殌馃殌馃殌TSMC is accelerating the expansion of its 2nm advanced process capacity. Senior Vice President and Deputy Co-COO Hou Yung-ching released a key signal, pointing out that in order to meet the explosive demand for artificial intelligence (AI) and high-performance computing (HPC), TSMC is pushing forward its expansion plan at "twice the speed" compared to the past. This year, five 2-nanometer wafer fabs have entered the ramp-up phase, setting a record for the most aggressive expansio
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